SMD Rework Solution
We are specialist for SMD Rework such as 0402 chip, CSP,BGA and QFP etc.
MSX1000 X-Ray System:
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Rework Station:
Accessories:
Related Systems:
Home(Products) > MSX1000 X-Ray System More Details sample data
MSX1000HR X Ray Inspection System
More Details sample data
BGA IMAGE TEST Screen:
Solder Ball Check
BGA Soldering Check (Bridge?): 55KV / 22 micro A / Angle - 0
Image Magnification: Left: x 33 / right: x 140
BGA Soldering Check (Open?): 55KV / 22 micro A / Image Magnification: x 40
Image Angle: left : 0 / right: 60 dgrees.
Left : BGA Soldering Check ( Bal Lost? ) : 55KV / 22 micro A / Image Magnification: x 33
Right : Void of BGA : 52KV / 22 micro A / Image Magnification 78
BGA Solder Ball Measuring Screen: (Auto Judgement is possible)
Void and ball size measuring
52KV / 22 micro A / Image Magnification: x 78 / Angle 0
Left : Void and Ball size measuring : 60KV / 22 micro A / Image Magnification: x 140 / Angle: 0
Right :Position error of the hole : 45KV / 22 micro A / Image magnification: x 23 / Angle: 0
Image Magnification: Left: x 33 / right: x 140
Left : Wire Frame position error measuring : 50KV / 22 micro A / Image magnifire: x 78 / Angle: 0
Right : Coating void measuring : 62KV / 22 micro A / Image Magnification: x 53 / Angle: 0
Left : 3 Dimension Display
Right :4 way display
M.S.Engineering Co.,Ltd.
2-17-11, Shinyokohama Kohoku-ku Yokohama-shi, Kanagawa-ken 222-0033 Japan. Phone: +81-45-472-6441 / Fax: +81-45-472-6432
Copyright(C)2007 M.S.Engineering Co.,Ltd. All rights Reserved.
2-17-11, Shinyokohama Kohoku-ku Yokohama-shi, Kanagawa-ken 222-0033 Japan. Phone: +81-45-472-6441 / Fax: +81-45-472-6432
Copyright(C)2007 M.S.Engineering Co.,Ltd. All rights Reserved.