Outline of the MS Nozzle |
![]() Standard Nozzle ![]() Cross bit nozzle ![]() Parts Clip Nozzle ![]() BGA socket nozzle |
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The package is taken up horizontally by the center-bit with bit- ring. the bit ring is slid up and down and attracts the package certainly. The height of the center-bit is changeable, it should be adjusted to height of the package. And it will be possible if the lock-nut of the center-bit is loosened. So, MS rework nozzle will be made possible of reworking that all most all of the SMD. Furthermore, we can manufacture of special nozzle hood and also center-bit. It became possible to even rework the SMD of special form by that cause. |
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Setting of the nozzle |
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| We recommend of the position that the BGA holds (H) is about 0.5mm in the nozzle. It is because, when the BGA are mounted on the board, the vacuum of the center bit is off, therefore, the BGA is falls slightly on the board. And the BGA should be in the best position to heating then. |
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| Nozzle Type | Package size | Inner size of Nozzle |
| 0505B00M | 5.0x5.0mm | 5.5x5.5mm |
| 0507B00M | 5.0x7.0mm | 5.5x7.5mm |
| 1010B00M | 10.0x10.0mm | 10.5x10.5mm |
| 1111B00M | 11.0x11.0mm | 11.5x11.5mm |
| 1212B00M | 12.0x12.0mm | 12.5x12.5mm |
| 1515B00M | 15.0x15.0mm | 15.5x15.5mm |
| 2020B10M | 20.0x20.0mm | 21.0x21.0mm |
| 2525B10M | 25.0x25.0mm | 26.0x26.0mm |
| 2727B10M | 27.0x27.0mm | 28.0x28.0mm |
| 3030B10M | 30.0x30.0mm | 31.0x31.0mm |
| 3535B10M | 31.0x31.0mm | 32.0x32.0mm |
| 4040B10M | 40.0x40.0mm | 42.0x42.0mm |
| 4545B10M | 45.0x45.0mm | 46.0x46.0mm |
The specification are subject to change without notice.